"ليعلم أبناءنا أن أباءهم وأجدادهم كانوا رجالاً، لا يقبلون الضيم ولا ينزلون أبداً على رأي الفسدة ولا يعطون الدنية أبداً من وطنهم أو شرعيتهم أو دينهم"... رئيس جمهورية مصر العربية
Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon (Materials and Processing Technology) By Krishna Seshan
2002 | 656 Pages | ISBN: 0815514425 | PDF | 8 MB
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.
This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
2002 | 656 Pages | ISBN: 0815514425 | PDF | 8 MB
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.
This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
